Ultrasonic Megasonic Cleaning Device for CMP Processes
Ultrasonic cleaning by Sonosys for slurry removal in CMP engineering.
In the CMP process, the removal of slurry from the wafer surface is a critical process that affects product quality. Residual slurry on the wafer surface can lead to defects and reduced yield in subsequent processes. Sonosys' ultrasonic megasonic cleaning equipment achieves high cleaning power and uniform cleaning, contributing to quality improvement in the CMP process. [Usage Scenarios] - Slurry removal in the CMP process - Foreign matter removal in the wafer manufacturing process - Rinse process after chemical cleaning [Effects of Implementation] - Reduction in cleaning time - Improvement in cleaning quality - Enhancement of yield
- Company:ティックコーポレーション 本社
- Price:Other